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Poland
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Welcome to the Polish National Network for the ELFNET Project ...

The National Representative for Poland is:

Zbigniew MoserInstitute of Metallurgy and Materials Science, Polish Academy of Sciences







Zbigniew Moser
Institute of Metallurgy and Materials Science, Polish Academy of Sciences
Krakow

You are free to explore and meet other ELFNET members from Poland!

Please also visit our ELFNET Poland website - click here


Steps of realization of ELFNET project in Poland


  • Initial actions driving at the collection of data-base with addresses of the institutions in Poland connected with problems of lead-free soldering

  • List of Polish institutions co-operating in the frame of ELFNET project

  • Preparation of the paper on ELFNET network, " ELFNET - a new chapter in integrating research on lead-free brazing alloys in Europe", published in Rudy i Metale Nieżelazne, R50, 2005, 1, 21-23 , showing the possibilities and profits of participation in ELFNET project.

  • Preparation of short notes about the establishment of ELFNET - European Project and plans of its actions in Poland, sent to five Polish monthly magazines: Elektronika, Elektronika Praktyczna, Elektrosystemy, Instalator, Elektronik

  • Workshop : ELFNET-Polska - Lead-free Soldering Network - held at Institute of Metallurgy and Materials Sciences, Polish Academy of Science, Krakow, Reymonta str. 25, May 13, 2005

  • "Institute of Metallurgy and Material Science's Way to the Participation in ELFNET Project" - Prof.dr hab.inż. Zbigniew Moser - Coordinator of the ELFNET - Polish National Network, Institute of Metallurgy and Material Science (IMIM) of the Polish Academy of Sciences (PAS), Krakow - the paper presented as a lecture during the workshop in Krakow, May 13, 2005 and published in Elektronika 9/2005

  • Creation of Polish internet website http://www.elfnet.pl with details of the realization of ELFNET project

  • The special issue of monthly magazine Elektronika No 9/2005 devoted mainly to a wide spectrum of aspects related with lead free solders

  • Bibliography of scientists from Polish institutions, related with lead-free soldering


    • L. Litynska, J. Wojewoda, P. Zięba, M. Faryna, W. Gust, E. J. Mittemeijer., Characterization of Interfacial Reactions in Cu/In/Cu Joints, Microchim. Acta 145, 2004, pp. 107-110.

    • G.A. López, S. Sommadossi,P. Zięba, W. Gust, E.J. Mittemeijer., Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections, Materials Chemistry and Physics, 78, 2002, pp. 459-463.

    • G.A. LÓPEZ, S. SOMMADOSSI, W. GUST AND E.J. MITTEMEIJER.P. Zięba., Phase Characterization of Diffusion Soldered Ni/Al/Ni Interconnections, INTERFACE SCIENCE 10, 2002, pp. 13-19.

    • S. Sommadossi, L. Litynska, P. Zięba , W. Gust, E.J. Mittemeijer, Transmission electron microscopy investigation of the microstructure and chemistry of Si/Cu/In/Cu/Si interconnections, Materials Chemistry and Physics 81, 2003, pp. 566-568.
    • E. Jezierska, G.A. López ,P. Zięba., Transmission electron microscopy of diffusion-soldered Ni/Al/Ni interconnections, Materials Chemistry and Physics 81, 2003, pp. 569-572.

    • J. Wojewoda, P. Zięba., THE ROLE OF INTERMETALLIC PHASES IN LEAD-FREE JOINING TECHNOLOGIES, AMAS-ISN Workshop on Fundamentals of Intermetallics, Metal-Ceramic Composites and Functionally Graded Materials, Krakow 2004, pp. 247-284.

    • J. Wojewoda, P. Zięba, A. Wierzbicka., Growth kinetics of the intermetallic phases in the Cu/In-Bi22at.%/Cu interconnection, Defect and Diffusion Forum, vols. 237-240, 2005, pp.1188-1192.

    • J. WOJEWODA, G.A. LÓPEZ, P. ZIĘBA, E.J. MITTEMEIJER, DIFFUSION PROCESSES IN DIFFUSION-SOLDERED INTERCONNECTIONS, Archives of Metallurgy and Materials, vol. 49, 2004, Issue 2.

    • M. Lipiński, P. Panek, A. Wierzbicka, J. Wojewoda, L.A. Zabdyr, P. Zięba., Development of Environment-friendly Technologies in Poland, Polish-Swedish Symposium, Materials-Energy Supply-Society&Environment, Göteborg December 12, 2003.

    • P. Zięba, J. Wojewoda., Application of diffusion soldering in lead-free interconnection technology, Recent Res. Devel. Mat. Sci., 4, 2003, pp. 261-282.

    • R. Kisiel, J. Sitek, K. Bukat, W. Gąsior, Z. Moser, J. Pstruś., Influence of Repair Process on Joint Properties on Near Eutectic SnAgCu Solders, Proceedings of European Microelectronics and Packaging Symposium, Prague, 2004,pp.299-304.

    • Z. Moser, W. Gąsior, J. Pstruś, S. Ishihara, X. J. Liu, I. Ohnuma, R. Kainuma and K. Ishida., Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb Ternary System, Mat.Trans,45,2004,pp.652
    • W. Gąsior, Z. Moser, J. Pstruś., Measurements of the Surface Tension and Density of Liquid Tin Based Sn-Ag-Cu-Sb Alloys, Archs. Metallurgy, 49. 2004, pp. 155-167.

    • W. Gąsior, Z. Moser, J. Pstruś., Surface tension and density of liquid Sn-Sb alloys, J. Phase Equilibria, 24, 2003, pp. 504-510.

    • W. Gąsior, Z. Moser, A. Dębski., Surdat-Database of the Physical Properties of Liquid Lead-Free Solders, Archives of Metallurgy and Materials. 49, 2004, pp. 575-583.

    • Z. Moser, W. Gąsior, J. Pstruś., Lead-Free Soldering Materials, Inżynieria Materiałowa, 2, 2002, pp. 65-68.

    • W. Gąsior, J. Pstruś, Z. Moser. A. Krzyżak and K. Fitzner., Surface Tension and Thermodynamic Properties of Liquid Ag-Bi Solutions, J. Phase Equilibria, 24, 2003, pp. 40-49.

    • K. Bukat, J. Sitek, Z. Moser, W. Gąsior, R. Kisiel., Meniscographic Method of Investigation of Interfacial Surface Tension between Lead-free solders and fluxes

    • W. Gąsior, Z. Moser, J. Pstruś., Study of lead-free soldering materials (in Polish), Rudy i Metale, R 47, 2002, pp.427-432.

    • R. Kisiel, W. Gasior, Z. Moser, J. Pstrus, K. Bukat and J. Sitek., (Sn-Ag)eut+ Cu Soldering Materials, Part II, J. Phase Equilibria and Diffusion, 25, 2004, pp. 122-124.

    • W. Gąsior, Z. Moser, J. Pstruś, K. Bukat, R. Kisiel, J. Sitek., Wettability Studies of the (Sn-Ag)eut+ Cu Soldering Materials Part 1, J. Phase Equilibria and Diffusion, 25. 2004, pp. 115-121.

    • Z. Moser, W. Gąsior, J. Pstruś, S. Księżarek, Surface Tension and Density of the (Ag-Sn)eut+Cu liquid Alloys, J. Electronic Materials, 31, 2002, pp.l225-1229.

    • X. J. Liu, Y. Inohana, I. Ohnuma. R. Kainuma. K. Ishida,Z. Moser, W. Gąsior, J. Pstruś, Experimental Determination and Thermodynamic Calculation of the Phase Equilibria and Surface tension of the Ag-Sn-In System. J. Elec. Mater,31,2002,pp.l1

    • Z. Moser, W. Gąsior, J. Pstruś., Surface Tension Measurements of the Bi-Sn and Sn-Bi-Ag Liquid Alloys, J. Electron. Mater., 30, 200l, pp. l104-1111.

    • Z. Moser, W. Gąsior, J. Pstruś, W. Zakulski, I. Ohnuma, X. J. Liu, Y. Inohana, K. Ishida., Studies of the Ag-In Phase Diagram and Surface Tension Measurements, J. Electron. Mater., 30, 2001, pp. l120-1128.

    • W. Gąsior, Z. Moser, J. Pstruś, M. Kucharski., Viscosity of the Pb-Sn Liquid Alloys,

    • Z. Moser, W. Gąsior, J. Pstruś., Surface Tension of Liquid Ag-Sn Alloys. Experiment versus Modeling. Journal of Phase Equilibria, 22, 200 l, pp. 254-258.

    • W. Gąsior, Z. Moser, J. Pstruś., Density and Surface Tension of the Pb-Sn Liquid Alloys. Journal of Phase Equilibria, 22, 200l, pp. 20-25.

    • W. Gąsior, L. Zabdyr, P. Zięba, Lead-free solders, ACADEMIA, Research in progress Science, Nr2 (2), 2004, p. 23.
    • R. Kisiel, J. Sitek, K. Bukat, W. Gąsior, Z. Moser, J. Pstruś., Influence of Repair Process on Joint Properties on Near Eutectic SnAgCu Solders, Proceedings of European Microelectronics and Packaging Symposium, Prague, 2004,pp.299-304.

    • W. Gąsior, J. Pstruś, Z. Moser. A. Krzyżak and K. Fitzner., Surface Tension and Thermodynamic Properties of Liquid Ag-Bi Solutions, J. Phase Equilibria, 24, 2003, pp. 40-49.

    • K. Bukat, J. Sitek, Z. Moser, W. Gąsior, R. Kisiel., Meniscographic Method of Investigation of Interfacial Surface Tension between Lead-free solders and fluxes

    • R. Kisiel, W. Gasior, Z. Moser, J. Pstrus, K. Bukat and J. Sitek., (Sn-Ag)eut+ Cu Soldering Materials, Part II, J. Phase Equilibria and Diffusion, 25, 2004, pp. 122-124.

    • W. Gąsior, Z. Moser, J. Pstruś, K. Bukat, R. Kisiel, J. Sitek., Wettability Studies of the (Sn-Ag)eut+ Cu Soldering Materials Part 1, J. Phase Equilibria and Diffusion, 25. 2004, pp. 115-121.