ELFNET has published its third and last annual report on the implementation status of lead-free soldering technology in Europe.

The analysis is based on survey questionnaires distributed between November 2006 and February 2007. Results have been compared with those of the two previous studies in 2004 and 2005, showing some clear dynamics in materials selection.

An unexpected result shows that although 75% of the respondents operate in sectors that are out of the scope of the RoHS Directive or in which the use of lead is (partially) exempted from the RoHS Directive, only 25% reported continued use of SnPb solder. This includes those who are exporting to countries outside the RoHS Directive.

As a general trend, in most applications certain alloys have a high or even increasing preference, like e. g. and at the same time there is an increasing number of other alloys which are used as well.

SnAgCu (SAC) alloy has always been the predominant choice in reflow soldering (around 70%) but it has now grown from 18% to 59% in wave soldering and from 54% to 75% in hand soldering.

Only around 12-13% of PWB and component finishes were still reported as SnPb. However, instead of harmonising, the number of different types of finish used has increased since 2004 from 7 to 10 in 2006. The picture on solder ball alloys had improved since 2004 when 62% didn't know what alloy would be used. Now it been reported that again the majority, around 37%, are SAC alloy.

The report also includes limited data on regional variations with US and Japan, as well as equipment purchases/upgrades.

Although the deadline for the ban of lead has passed since 1 July 2006,  around 80% of the survey participants still reported implementation problems of some kind, with a high diversity of questions.

The full report can be downloaded for free on the reference link below: