After years with thousands of seminars, workshops and conferences around the electronics world including predictions and warnings about the consequences of the lead ban, we have now, 6 months after the implementation of the RoHS directive, reached the point where many companies with high quality electronic products realise that transferring to lead free soldering production will not necessarily be a piece of cake.

IPC and Soldertec Global have accepted the challenge and taken a firm grip on the subject of Reliability. A number of experts in the reliability field have been engaged such as Jean-Paul Clech who will give an in-depth review of “Lead Free Solder Joint Reliability” and Dr. Yoshiharu Kariya, active at the Shibaura Institute of Technology, presenting “Fatigue Characteristics of Lead free Solder Alloys”. A number of European experts from the ELFNET project, including IMEC, Ericsson, IVF, EMPA and the Fraunhofer Institute will detail the latest European perspective.

To give the European electronics industry more answers in this area and offer extra value for the attendees, the IPC/Soldertec conference will be held in connection with the a Dissemination Event by the EU projects ELFNET, GREENROSE and LEADOUT. This will deliver results of more than 3 years high-level research into lead-free technologies.

This combined event gives an excellent opportunity to find solutions on key questions like poor wetting, solderability on different surface treatments, heat resistance of FR4 material, lead contamination and CAF. The question is, can companies committed to quality, high reliability products afford not to come to San Sebastian, Spain, February 28- March 2?

Please join us in San Sebastian to meet global experts in lead-free soldering quality and reliability issues and find solutions for tomorrow’s electronic production processes. 

See the reference link below for more details:

Lars Wallin, IPC European Representative
Tom Perrett, Soldertec Global
Jeremy Pearce, ELFNET Coordinator