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| PandA Europe |
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| Mr Andy Longford |
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| profile |
Andy Longford C Eng FIEE. Since 1998, Andy has been a director of PandA Europe, a European technical market consultancy company involved in Semiconductor Chip Manufacturing, specialising in Packaging and Electronics Interconnection.
He is currently involved in a number of European programs for MEMS package needs and has published a number of technical papers related to chip packaging technology.
Andy is a member of IMAPS UK and the chairman of the UK Industrial Advisory group for work on conductive adhesives. He has been Chairman of the SEMI European Test, Assembly and Packaging (TAP) Standards Committee since 1994 and is currently Co-Chair of the SEMI European Regional Standards Committee and a member of the SEMI International Standards Committee. From 2004, as part of the European ELFNET project,
Andy is responsible for coordinating the Industry network activity in Lead(Pb) Free Electronics in Europe. Within SEMI he is now involved with the formation of working groups for the development of Standards in Flip Chip and Wafer level packaging. |
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| Key: | Automotive & Industrial, Components, Industry, UK |
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