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| IMEC - Interuniversity Microelectronics Center |
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| Dr. Jan Vanfleteren |
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| profile |
Jan Vanfleteren graduated from the Gent State University as an Electronics Engineer in 1981 and obtained his PhD in 1987 from the same university.
He is currently a senior engineer at IMEC, INTEC/TFCG group and is involved in the development of novel interconnection, assembly and substrate technologies, especially in flip-chip, adhesive and flex technologies.
He is a member of IMAPS and IEEE and (co)-author of over 100 papers in international journals and conferences.
As a project manager for TFCG he is involved in a number of EC funded projects : FP5-IST-'CARBINE', FP6-IP-'FLEXIDIS'. Moreover he is the co-ordinator of FP5-GROWTH-'IMECAT' (on interconnection materials and assembly processes development for lead-free electronics assembly) and FP6-IST-IP-'SHIFT' (on the development of high-integration multilayer flex substrate and assembly technologies). |
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| Key: | Assembly, Belgium, Components, Research |
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