The Berlin Center of Advanced Packaging (BeCAP) is a cooperation between the Forschungsschwerpunkt Technologien der Mikroperipherik of the Technische Universität Berlin (TUB-MP) and the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (Fraunhofer IZM). Research at BeCAP focuses on advanced methods of packaging in the fields of microelectronics and microsystems (MEMS).
contact
Technische Universität Berlin- Fakultät IV , BeCAP, Sekretariat TIB 4/2-1, Gustav-Meyer-Allee 25, Berlin, D-13355, GERMANY
BeCAP focusses on development of packaging technologies, micro devices and equipment, mechanical reliability and micro materials, polymeric materials and composites, and environmental engineering.
Facilities include FE-Analysis, materials characterisation, lifetime estimation, LIPAN and FTIR spectrometers, recycling laboratory, automated de-soldering pilot line.
The organisaiton is a partner in the HITAP project - 3 Papers, the EFSOT project - Assembly & Environmental, the GREENROSE project - for SME's.
It also organises an industrial lead-free working group and the International Green Electronics Congress (EGG).
Through IZM it hosts the German Infopool lead-free website.
Key:
Assembly, Germany, Recycling, Research organisation, Solders
