Univie has extensive experience with alloy preparation & characterisation, including calculation & determination of phase equilibria, thermodynamic properties, & surface properties.
It coordinates the COST 531 network on lead-free soldering and is a partner in COST 507 - Alloy development. It also leads several Austrian Research Foundation (FWF) lead-free projects:
PhD Theses
Sabine Knott:
Thermodynamic investigations on lead free solder materials (finished 2004)
Usman Saeed:
Thermochemistry of intermetallic systems relevant for lead free soldering (started 2004)
Christoph Luef:
Ag-In-Sn Alloys as Possible Lead-free Soldering Materials: Interaction with Pd as Substrate (Thermochemistry and Phase Equilibria) (finished 2004)
Clemens Schmetterer (PhD Thesis):
Investigation of Alloy Systems relevant for Lead-Free Soldering(started 2005)
List of Publications
Nadezhda Asryan and Adolf Mikula, Thermodynamic Properties of liquid Bi-Sn alloys, Z. Metallkd. 95 (2004) 132.
N.A. Asryan and A. Mikula, Thermodynamic properties of Bi-Sn Melts, Neorg. Mater., 40 (2004) 457 (in Russian).
C. Luef, H. Flandorfer, H. Ipser, Lead-free Solder Materials: Experimental Enthalpies of Mixing in the Ag-Cu-Sn and Cu-Ni-Sn Ternary Systems, Z. Metallkd. 95 (2004) 151.
C. Luef, H. Flandorfer, and H. Ipser, Enthalpies of Mixing of Liquid Alloys in the In-Pd-Sn System and the Limiting Binary Systems, Thermochim. Acta 417 (2004) 47.
C. Luef, H. Flandorfer and H. Ipser, Lead-free solder materials: experimental enhalpies of mixing in the Ag-Cu-Sn and Cu-Ni-Sn ternary systems Z. Metallkde., 95 (2004) 151.
C. Luef, H. Flandorfer and H. Ipser, Enthalpies of mixing of liquid alloys in the In-Pd-Sn system and the limiting binary systems Thermochimica Acta, 417 (2004) 47.
O. Semenova, H. Flandorfer, and H. Ipser: On the Non-occurrence of Tin Pest in Tin-Silver-Indium Solders; Scripta Mater. 52 (2004), 89.
S. Knott and A. Mikula, Thermodynamic Properties of Several Ternary Zinc Alloys, Metallurgical and Materials Processing: Principles and Technologies, Vol. 1, TMS, 441-449 (2003).
A.Mikula, Zinc - a Possible Component in Lead-Free Solders, Metallurgical and Materials Processing: Principles and Technologies, Vol. 1, TMS, 395-403 (2003).
S. Knott and A. Mikula, The state of art of lead free soldering, Proceedings 4th Int. Conf. on Thermal Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, Euro SIME2003, 429-433, (2003).
S. Knott and A. Mikula, A new investigation of the enthalpy of mixing in the binary Cu-In system, accepted for publication in Z. Metallkd.
C. Luef, A. Paul, H. Flandorfer, A. Kodentsov, H. Ipser, Enthalpies of Mixing of Intermetallic Systems Relevant for Lead-free Soldering: Ag-Pd and Ag-Pd-Sn, J. Alloys Comp., accepted for publication (2004).
C. Luef, H. Flandorfer, H. Ipser, Lead-free Solder Materials: Experimental Enthalpies of Mixing in Quaternary Liquid Ag-In-Pd-Sn Alloys, Metall. Mater. Trans. A, submitted for publication (2004).
A. Zemanova, A. Kroupa, J. Vrestal, O. Semenova, K. Chandrasekaran, K.W. Richter, H. Ipser: Phase Equilibria in the Ag-In-Pd System at 700°C; Monatsh. Chem., submitted for publication.
C. Luef, H. Flandorfer, H. Ipser, Metallic Systems Relevant for Lead-free Soldering: The In-Pd-Sn Phase Diagram, Intermetallics, publication in preparation (2004).
H. Flandorfer, C. Luef, H. Ipser, Enthalpies of Mixing of Liquid Ag-Sn, Cu-Sn, and Ni-Sn Alloys, publication in preparation (2004).
A. Sabbar, H. Flandorfer, C. Luef, H. Ipser, Lead-free Solders: Experimental Enthalpies of Mixing of Liquid Bi-Cu and Bi-Cu-Sn Alloys, publication in preparation (2004).
