As an independent research center with over 1300 staff, IMEC focuses on the design, production and packaging of the chips of the future. New technologies and materials are evolving which are leading to the development of smaller transistors and which add extra functionality to the chip. These ultra-modern chips are the basis of the more complex, smaller and feature-rich electronic products that are integrating into our environment and lives almost without notice.
IMEC (Interuniversity Microelectronics Center) - is an independent RTO concerned with new design and fabrication technologies for next generation chips with industry interconnection/packaging technologies.
This includes thermomechanical modelling, test and reliability analysis.
Its facilities include: clean-room facilities at two locations, electronic assembly equipment (flip-chip bonders, vapour phase reflow solder machine, wire bonders, etc.) Test equipment: DAGE bond tester, climatic test chambers, automatic electrical measurement system, etc
It is a partner in a number of EU & National lead-free soldering research projects. It is the coordinator of the EU IMECAT project (2002 - 2005)and a partner in the EU CARBINE project(2000 - 2003) and the National TOLOSO project (2003 - 2006).
Key:
Assembly, Belgium, Components, Reliability, Research organisation
