They represent the very latest information on key topics in lead-free implementation. See the ELFNET Issues to Solutions Matrix for more details of the priority issues being considered within the ELFNET project.

Presentations given in the parallel network meetings for ELFNET members will be uploaded shortly.

EHC Legislation

Introduction, Pierre Lucas, SEMI

Update on REACH, Keith Huckle, Dow Corning

Update on PFO's, Aimee Bordeaux, SEMI

Update on IP/EuP, Julian Lageard, Intel Corporation

Update on RoHS, Paul Goodman, ERA

Supply Chain Issues

ELFNET Project Overview, Jeremy Pearce, ITRI/ELFNET Coordinator

Obsolescence, John Jones, IGG/Components Obsolescence Group

Component Supply, Dietmar Vieth, FarnellinOne

Marking and Labelling, Walter Huck, Murata/IEC TC97

Compliance Testing, Tom Perrett, Soldertec Global

Materials Declaration, Gerd Schulz, EPCOS/ZVEI

Lead-Free Standards

IECQ HSPM Certification, Valentine Menuet, LCIE

IPC Standards, Lars Wallin, IPC Europe

Semiconductor Standards, Andy Longford, PandA Europe

Design

Large and Complex Boards, Jacob Klerk, Philips Applied Technologies

Lead-Free Best Practice for SME's, Thomas Ahrens, Fraunhofer-ISIT

iNEMI Projects Overview, Chuck Richardson, iNEMI

Materials

Tin Whiskers, Antonello Vicenzo, Politecnico de Milano

Laminates, Per Johander, IVF

Lead-Free Solder Alloy Properties,Clemens Schmetterer, University of Vienna

Process

Hand Soldering, Eric Veninga, TNO

Rework and Repair, Anders Ekelof, Ericsson AB

The Role of Intermetallics, Toni Mattila, Helsinki University of Technology

Reliability

State-of-the-Art in Lead-Free Reliability, Guenter Grossmann, EMPA

Lead-Free Reliability Data, Bart Vandervelde, IMEC

Aerospace and Defence Perspective, Clive Simmonds, BAE Systems