| Issue | Definition | Solution | Info |
| Supply Chain |
| Materials Declaration |
Reporting required for compliance but lack of harmonisation |
Members |
Public |
| Component Numbering |
Only half PNs may change - affects logistics, tracking... |
Members |
Public |
| Marking & Labelling |
Some new standards but not fully harmonised or used in practice |
Members |
Public |
| Patents/IPR |
Effects on use restiction and price unknown |
Members |
Public |
| Component Availability |
Supplier roadmap information lagging |
Members |
Public |
| Alloy Supply |
SAC alloy variations, paste performance variable |
Members |
Public |
| Design |
| Standards |
Need more information and action |
Members |
Public |
| Obsolescence |
Medium-term availability of leaded components uncertain |
Members |
Public |
| Compliance |
Legislation interpretations unclear. Testing & certification lagging |
Members |
Public |
| Best Practice Guidelines |
More information needed |
Members |
Public |
| Large & Complex Boards |
Thermal issues - warping, rework. Component availability |
Members |
Public |
| Servers, Storage, Networks |
Temporary exemptions in place but issues not clear |
Members |
Public |
| Materials |
| Tin Whiskers Standard |
New standards - need to be adopted |
Members |
Public |
| Tin Whiskers Mechanism |
Mitigation requires better understanding |
Members |
Public |
| Thermal Compatibility |
Higher lead-free temperatures may need new materials |
Members |
Public |
| Intermetallics |
More technical information required - effects on reliability |
Members |
Public |
| SnZn Solders |
Interest increasing but needs more collaboration |
Members |
Public |
| Optimal Finishes |
Cu-OSP now possible? Information collation required. |
Members |
Public |
| Flux Interaction |
More aggressive fluxes used but ?effect on cleaning |
Members |
Public |
| Solder Alloy Properties |
Basic property data needs collation and publication |
Members |
Public |
| High Temperature Solders |
Is there a viable replacement? |
Members |
Public |
| Component Shelf Life |
Not properly studied for lead-free |
Members |
Public |
| Boards |
New problems seen in multi-pass processing multilayer epoxy |
Members |
Public |
| Solder Paste Performance |
Stencil wear, printing, pot life... |
Members |
Public |
| MEMS Capping |
New non-Au alloy required |
Members |
Public |
| SAC Alloy Microstructure |
New developments under way to improve properties |
Members |
Public |
| Process |
| Solder/Finish Compatibility |
SnPb/Bi coatings, SnPb/Pb-free BGA's.. |
Members |
Public |
| Reflow Profiles |
Equipment must be capable of limiting gradients |
Members |
Public |
| High Yield/High Volume |
Limitations of lead-free not fully known |
Members |
Public |
| Effect of cooling rate |
Is this a problem in practice? |
Members |
Public |
| Wave Soldering |
Wave design, fillet lifting, voiding, inspection, hole filling |
Members |
Public |
| Hand soldering |
Operator retraining, solder tip erosion, wetting, rework |
Members |
Public |
| Rework & Repair |
Effect on reliability. Damage to adjacent components. |
Members |
Public |
| Other Soldering Technologies |
Vapour Phase, Laser, Selective... |
Members |
Public |
| Other Joining Technologies |
Conductive adhesives, mixed assembly, spot welding.. |
Members |
Public |
| Voiding |
Temperature dependance, joint quality... |
Members |
Public |
| Merits of Nitrogen |
Still not clear - what ppm O2, balling, bridging.. |
Members |
Public |
| Inspection & Test |
MDA, needle probe wear, AOI, standards.. |
Members |
Public |
| Heterogeneous Assembly |
Combined assembly of ultrafine pitch/small components and large components |
Members |
Public |
| Quality & Reliability |
| Acceleration Factors |
Not available but needed for modelling |
Members |
Public |
| Long-Term Reliability |
Information scarce, projects just starting |
Members |
Public |
| Short-Term Reliability Data Exchange |
Much data but testing not harmonised and results complex |
Members |
Public |
| Field Failures |
More information needed |
Members |
Public |
| Test Methods |
Lack of harmonisation, still in development |
Members |
Public |
| Quality & Reliability Standards |
Some published but lagging |
Members |
Public |
| Harsh Environments |
Lead-free technology in non-standard enviroments not fully understood |
Members |
Public |
| Case Studies |
Not widely available |
Members |
Public |
| Test Equipment Sharing |
Centralised cooperation is desirable |
Members |
Public |
| Recycling |
| Life Cycle Management |
Not fully elucidated for lead-free |
Members |
Public |
| Regulation |
Overview of EU WEEE implementation and practices desirable |
Members |
Public |
| Infrastructure & Competence |
EU capabilities not mapped |
Members |
Public |
| Technology Impact |
Effect of increased Ag, Bi/Sb etc on refining, incineration.. |
Members |
Public |
| Specific Technologies |
Not enough data for eg. flip-chip, plated plastics |
Members |
Public |
| New Processes |
Opportunities for new recovery, selection technologies |
Members |
Public |
| Disassembly & Reuse |
Needs optimisation, effect on warranties ... |
Members |
Public |
